Dear MEMSNet colleagues,

I am currently having an RIE issue.
I am using Cu (copper) hard mask to etch patterned polymer with oxygen gas, but
the etch rate is very low.
When I try to etch the same material with Au mask it works fine (high etch
rates).
The same has happened when using Ni (nickel) hard mask and oxygen gas.

Is this some sort of catalytic reaction? If so, can anybody explain a bit more
in detail (just the principle, no mathematical models).

Thank you.

Ghazal Hakemi
PhD candidate Microsystems and Nanotechnology Centre
Cranfield University
Bedord, U.K.