Hi Dear Ananth

a) My prebake receipe is : 180C-60s. in hot plate.
b) For lower thickness, yes you are right, i observed less peeling problem.
c) I dont think that if there is a organic residue layer on my sample, but i
will try your receipe.
d) My substrate is SiC-HEMT.

Thank you very much for helping.

Best Regards.