A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Aluminum Bond pad reference
Aluminum Bond pad reference
2009-01-23
Jon R. Fox
2009-01-24
Brad Cantos
2009-01-26
Morten Aarøe
2009-01-26
Jon R. Fox
2009-01-27
shay kaplan
2009-01-27
Jordi Teva
2009-01-27
Wilson, Thomas
2009-01-27
Jordi Teva
2009-01-28
shay kaplan
2009-01-27
Edward Sebesta
Aluminum Bond pad reference
Wilson, Thomas
2009-01-27
Jordi,

Any comment about the adhesion of gold to bare aluminum? I've read somewhere
it's pretty awful.

Thomas

-----Original Message-----
From: [email protected] [mailto:[email protected]] On
Behalf Of Jordi Teva
Sent: Tuesday, January 27, 2009 12:20 PM
To: General MEMS discussion
Subject: Re: [mems-talk] Aluminum Bond pad reference

the Al bond pads provided by the semiconductor industry are not pure Al,
they are alloys with others metals, mostly Cu, just to avoid the
problem you have..
I do agree with Morten¨'s proposal with the Gold layer..,  I think you
will have a layer of alumina as
soon as you place your chips in the ambient air...

Jordi

reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
Harrick Plasma, Inc.
MEMStaff Inc.
Mentor Graphics Corporation
Nano-Master, Inc.