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MEMSnet Home: MEMS-Talk: Aluminum Bond pad reference
Aluminum Bond pad reference
2009-01-23
Jon R. Fox
2009-01-24
Brad Cantos
2009-01-26
Morten Aarøe
2009-01-26
Jon R. Fox
2009-01-27
shay kaplan
2009-01-27
Jordi Teva
2009-01-27
Wilson, Thomas
2009-01-27
Jordi Teva
2009-01-28
shay kaplan
2009-01-27
Edward Sebesta
Aluminum Bond pad reference
Jordi Teva
2009-01-27
I would try to deposit first a thin layer of Ti or TiN, then adhesion
should not be an issue..


On Tue, Jan 27, 2009 at 8:21 PM, Wilson, Thomas  wrote:
> Jordi,
>
> Any comment about the adhesion of gold to bare aluminum? I've read somewhere
it's pretty awful.
>
> Thomas
>
reply
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