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MEMSnet Home: MEMS-Talk: stress in bulk micromachining (ICP after anodic bonding)
stress in bulk micromachining (ICP after anodic bonding)
2009-02-19
matthew king
2009-02-19
Roger Shile
2009-02-20
matthew king
stress in bulk micromachining (ICP after anodic bonding)
matthew king
2009-02-20
Mr. Shile, thank you for your reply.

The ICP is used to etch a silicon layer of 60um (DRIE). The process is described
as follows. First, silicon is etched to define anchors. Secondly, glass and
silicon are bonded together. Then, ICP is used to define the movable structure.

--- Roger Shile  wrote:

> I think you need to describe a little more about the ICP
> process before
> this question can be answered.  ICP (Inductively Coupled
> Plasmas) are
> used for etching, plasma enhanced CVD and plasma emission
> spectrometers,
> among other diverse applications.
>
> Roger Shile
reply
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