Dear All

I am evaluating laser dicing technology for die singulation on ceramic
substrates.

There are 2 emerging technologies proposed by DISCO and Accretech

1) Stealth dicing, use of nanosecond pulse laser to generate
microcracks in the scribe which will propagate

2) Picosecond laser ablation

Does someone have experience with these technologies?
What are the PROs and CONs of both techniques?

Thanks for sharing your expertise

Daniel Rosenfeld