Hi Adam,

Try 50% NH4OH mixed with 50% H2O2 in a 1:1 ratio.  The reaction is
exotermic and will bubble vigorously.  I use it often on LiGA Nickel and
have not seen any effects on electroplated nickel.

Regards,
Yohannes M. Desta


At 04:10 PM 9/18/98 -0700, you wrote:
>Dear Colleagues,
>
>We are seeking a Cu etchant that doesn't cause any pitting or other damage
>to Ni. A commercial product we have tried, Enthone's Enstrip C38, seems to
>pit the Ni, at least sometimes.
>
>Does anyone have any suggestions on what we might try? They would be greatly
>appreciated.
>
>Sincerely,
>
>Adam Cohen
>USC/ISI
>
>
>