dear friends,

we are trying to plate Ni (electroless) on n-type Si wafer, we do observe
Ni deposition but there are adhesion issues on as deposited samples and
some times poor ahesion on annealed samples.  Has anyone had a similar
problem....?   if yes what was the solution...

thank you

Vikrant A. Chaudhari
Research Scholar
Energy Systems Engg
Indian Institute of Technology Bombay
Mumbai-400076
India

Tele-+912225764888

www.ese.iitb.ac.in/~vikrant