Are you using an adhesion layer such as Chrome or Titanium.  You may want to
deposit a thin layer (10 - 20 nm) before Ni deposition.  I know this helps
with thermal and e-beam evaporation but I am not sure that it will  help for
your plating method.


On Thu, Jun 11, 2009 at 12:32 PM, Vikrant A. Chaudhari 
wrote:

> dear friends,
>
> we are trying to plate Ni (electroless) on n-type Si wafer, we do observe
> Ni deposition but there are adhesion issues on as deposited samples and
> some times poor ahesion on annealed samples.  Has anyone had a similar
> problem....?   if yes what was the solution...
>
> thank you
>
> Vikrant A. Chaudhari

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EVELYN BENABE
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