Petru,

Although there are several mechanical ways to cut the wafers, I have a good
experience in cutting the wafers with laser.
For full disclosure, I am in the laser industry, so my opinion might be
considered biased. The lasers are non-contact, vibration free, very small
kerf (width of cut) and very fast. There are many choices of lasers, from IR
(Infrared thermal process) to non-thermal cutting such as the 193nm deep UV
Excimer and Femto/Pico pulse duration lasers. If some thermal impact is
allowed, the CO2 laser will be the least costly way to cut your part.


Best Regards,
David Benderly

PhotoScribe Technologies, Inc.
URL: www.photoscribetech.com


-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of Petru Lunca Popa
Sent: Tuesday, June 23, 2009 3:53 AM
To: General MEMS discussion
Subject: [mems-talk] Cutting Silicium pieces

Hi everyone

I am working with devices built by depositing Au on Si/SiO2 wafers .On
a 2cm/2cm piece of Si I am having 4 devices so I need to cut . Does
anyone can reccomand me a good and precise cutting machine?
I need a precision of half of milimeter (the distance between samples
is 1mm). Also I am performing some FIB or Ebeam on those samples so I
want to avoid strong vibrations.

So Anyone knows a good machine to cut ? Or a method what can help me?

Thank you
Petru