Dear Mr. Yanghua

we are working on microfluidic devices for spectroscopic applications
(determination of the first hyperpolarizability in fluids by
hyper-rayleigh scattering). For this, we wet chemically etch channels in
fused silica substrates which already works quite well. But we still
have major problems sealing our half-channel in the substrate with a
cover plate.

Unfortunately, I know very little about sealing/bonding glass-glass
apart from what you find in every standard MEMS book. Furthermore, I
found only one paper dealing with glass-glass-bonding (Raley, Davidson,
Balch; Spie vol. 2639). Can you provide any clues for further literature
dealing with direct glass-glass and frit bonding and the pros and cons
associated with the various approaches ? Could you also forward the
responses to me you got after posting your message since we have pretty
much the same requirements (bonding without deformation) ?

Thank you very much in advance.

Best regards,

Matthias Grewe
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Matthias Grewe (grewe@physik.uni-kl.de)
AG Integrierte Optoelektronik                    Phone: +49-631-205-4421
Uni Kaiserslautern                               Fax:   +49-631-205-4147
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