Dear Mr. Winfield,

regarding your request concerning the Au-Si eutectic bonding I can
recommend the book "Fundamentals of Microfabrication" by Marc Madou,
ISBN: 0-8493-9451-1 (the book says on page 392: ... eutectic bonding
takes place at 363°C ...). But you will certainly find many further
valuable references in this book.

Like you, I am also very interested in sealing/bonding glass to glass,
though I would prefer a direct bonding which does not distort/deform
channels etched in the substrate before (we are working on microfluidic
devices for spectroscopic applications, i.e. determination of the first
hyperpolarizability in fluids by hyper-rayleigh scattering). On the
other hand, I have to admit, that I know very little about
sealing/bonding glass-glass apart from what you find in every standard
MEMS book (like the one mentioned above), so there may be alternatives
which I do not even know about. Therefore, I would be glad, if you could
forward the responses to me you got after posting your message. May be
you can even provide some literature references dealing with the
different possibilities of bonding glass-glass and the pros and cons
associated with the various approaches.

Thank you very much in advance.

Best regards,

Matthias Grewe
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Matthias Grewe ([email protected])
AG Integrierte Optoelektronik                    Phone: +49-631-205-4421
Uni Kaiserslautern                               Fax:   +49-631-205-4147
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