Brad,

Here's more info on doing lift-off of sputtered metals with AZ5214E.

Regarding my recipe for liftoff with AZ5214E for small numbers of samples, as
the temperature on a hot plate varies substantially (not quantified yet myself
although I'm looking into traceable IR thermometers to do so), for the post-bake
I position only a single chip (12 mm x 16 mm) in the center of the 6" x 6"
hotplate each time for consistency (probably out of the question for any serious
production work). For the pre-bake (I don't find it to be as critical), I
position 4 chips in a 2 x 2 array in sequence and remove in same sequence to
ensure equal times on the hotplate. Perhaps this is the reason I've been getting
consistent results. I forgot to mention, I use "AZ Developer 1:1" for 2 min 15
sec (contact Mays Chemicals in Indianapolis, IN ~$130 for 4, 1 gal containers),
as it doesn't etch aluminum and I've found quite a number of other common
developers do attack aluminum.

Thomas