Hi All,

Has anyone tried and succeeded in processing a 100 micron thin -- die of
size 20mm x 20 mm or 2-inch wafers ? What were the main issues you
encountered while processing?

Is it possible to perform lithography (using contact aligner) on
such a thin die or wafer using the alignment features located on the
other side (back-side) ?

Please share your experiences, either in the forum or in person (by
e-mail). Any tip(s)/suggestion(s) are appreciated.

Thanks,
Vijay

TU Delft