Hi Natsuki,

One trick you can try is to perform edge grinding of your laser cut wafers.

Regards,
Vijay
(TU Delft, NL)

-----Original Message-----
From: [email protected] [mailto:[email protected]] On
Behalf Of Miyakawa, Natsuki
Sent: dinsdag 3 november 2009 15:32
To: General MEMS discussion
Subject: [mems-talk] Laser cutting of silicon

Dear all,

After cutting silicon wafer with laser (frequency-tripled Nd:YAG-laser with wave
length 355nm) I observe that the silicon surface turned quite rough around the
cutting edge (height up to ~1µm, width ~ 50µm). Do you know some trick to avoid
or remove this surface roughening so that the surface quality is good enough for
silicon fusion bonding after laser cutting?

Thank you!

Cheers

Natsuki