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MEMSnet Home: MEMS-Talk: Laser cutting of silicon
Laser cutting of silicon
2009-11-03
Miyakawa, Natsuki
2009-11-03
Vijay Rajaraman - EWI
2009-11-03
Michael D Martin
2009-11-03
Ned Flanders
Laser cutting of silicon
Ned Flanders
2009-11-03
Hello Natsuki,

what is the pulse duration and what is the repetition rate? Usually
Nd:YAG lasers have pulse durations of several nanoseconds. The general
rule is that a much better quality of ablation is obtained by
decreasing the pulse width. The shorter the better. Keep the fluence
near threshold, but not much above it.


cheers


mario

-------------------------------------------------------------------
Dear all,

After cutting silicon wafer with laser (frequency-tripled Nd:YAG-laser
with wave length 355nm) I observe that the silicon surface turned
quite rough around the cutting edge (height up to ~1痠, width ~ 50痠).
Do you know some trick to avoid or remove this surface roughening so
that the surface quality is good enough for silicon fusion bonding
after laser cutting?

Thank you!

Cheers

Natsuki
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