Dear Colleagues,

I am looking for a Ni etchant that does not cause any pits or damages
to Cu. Ni and Cu were formed by electroplating in Watt and Sulfuric
bath, respectively. I would sincerely appreciate you if you could let me

know...
Thanks.
--
Jun-Bo Yoon
Ph.D. Candidate
Dept. of E.E., KAIST
373-1 Kusong-dong, Yusong-gu
Taejon 305-701 Korea
Phone: +82-42-869-8524
Fax: +82-42-869-8530
E-mail: jbyoon@eeinfo.kaist.ac.kr
WWW: http://mirine.kaist.ac.kr