Hi, Will,

Cu seed layer works well for many electroplating deposition especially for
Copper electroplate. Au is the worst seed layer I have ever used for
electroplating.

Best wishes,
Fei

-----邮件原件-----
发件人: [email protected] [mailto:[email protected]]
代表 Will Yu
发送时间: 2010年1月28日 7:55
收件人: General MEMS discussion
主题: [mems-talk] Adhesion problem between electroplated Copper and Goldseed
layer

Hi all,

I was trying to electroplate Cu on gold seed layer by using SU8 as mask.
After plating, all the small Cu patterns were  released when I tried to
remove
SU8 in remover PG @ 80C. Is there anyway to improve the adhesion? Does
it help if I evaporate Cu as seed layer or dry etch SU8? Any suggestion
is appreciated.

For dry etching SU8, could anyone provide a recipe with fast etching rate
(my SU8 is about 100um thick)?

Thanks,
Will