Your seed payer should always be the same material you are trying to
electroplate.

Rick


-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Will Yu
Sent: Thursday, January 28, 2010 1:55 AM
To: General MEMS discussion
Subject: [mems-talk] Adhesion problem between electroplated Copper and
Goldseed layer

Hi all,

I was trying to electroplate Cu on gold seed layer by using SU8 as mask.
After plating, all the small Cu patterns were  released when I tried to
remove
SU8 in remover PG @ 80C. Is there anyway to improve the adhesion? Does
it help if I evaporate Cu as seed layer or dry etch SU8? Any suggestion
is appreciated.

For dry etching SU8, could anyone provide a recipe with fast etching
rate
(my SU8 is about 100um thick)?

Thanks,
Will