Dear colleague,

I am working on the processing of a MEMS-based infrared image device,
everything goes through well but the release of the device. Here are
the problems: first, since the micro-machined structures are very
flimsy, I couldn't stir the resolution violently, thus bubbles arising
in the etching process of SiO2 not only prevented the uniform etching
but also destroyed the structures; second, as I haven't a
supercritical desiccator or a squeezing drier, after removing of the
sacrificial layers, the suspending structure always corrupted because
of the capillary forces.

Are there any good ideas on the release/drying process? Your help is
highly appreciated.

Best regards.

Liuqiang Zhang, Ph.D. Candidate,

State Key Laboratories of Transducer Technology,

Shanghai Institute of Metallurgy, Academia Sinica

Email: [email protected]

Tel: +86-21-625-11070 ext. 8603