Andrea,

Yes.  Any particles on the surface of the wafer before or during deposition will
compromise the continuity of the film and allow penetration of the etchant.

Dan

-----Original Message-----
From: Andrea Mazzolari [mailto:[email protected]]
Sent: Monday, April 05, 2010 11:04 AM
To: Ruiz, Marcos Daniel (SENCOE)
Cc: [email protected]
Subject: RE: [mems-talk] metallic mask

Hi Dan,
do you mean that there could be some particles on the wafer surface ?

Best regards,
Andrea