The size the should not be the problem. Try the suggestions from the
others. Must work.

Good luck!

Regards,

Denis

2010/8/10 Sandeep Makhar :
> Hello All-
>
> Thanks for all your responses. They have been useful.
>
> Yingnan-
>
> I am using AlN substrate with sputtered copper prior to the DF process. I
> have tried using oxygen plasma in the past, post development. It seems to
> oxidize the copper. Also, on visual inspection the foot of the DFR seemed
> unaffected.
>
> Ningyuan-
>
> We agree, the problem could be from insufficient rinsing post development..
> We have to address it by rinsing for at least one minute in DI water and
> then immerse it in water for about a minute before spray rinsing and drying.
> There is not much visible at the foot of the DFR post development. However,
> post flood exposure there is a shadow like appearance at the foot of the
> resist. We believe could also be causing a problem. I am interested in
> trying the two step develop and would share the results.
>
> Ying-Tao-
>
> Thanks Ying-Tao. The issues you mention could cause a problem.
>
> Denis-
>
> I am using a 3 mil dry film from Eternal, E9230. The feature size is huge..
> These are about 8 to 10 mils.
>
> Thanks again. Please feel free to to ask if there are any questions or
> suggestions.
>
> Regards,
>
> Sandeep

--
День

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