The temperature and time depends on the curie temperature of the
material to keep the material in a poled condition. For the PZT I
would use this is about 300degC to completely depole. Significant
depoling can occur at say Tcurie/2 about 170degC if the time is
more than 30 mins (say). I have not actually tested this yet
however.
Another problem is that exceeding that temperature can easily
generate cracks just under the surface due to local stresses and
crack growth in the ceramic.
All in all the temperature is best kept under 200degC and
preferably under 150degC for less than 1 hour. Alternatively, poling
a bonded material may be worth investigating.

Phil Rayner


On 4 Nov 98, at 11:50, bob lyness wrote:

From:                   "bob lyness" 
To:                     "Phil Rayner" ,
        
Subject:                Re: Bonding bulk PZT to Silicon/Other
Date sent:              Wed, 4 Nov 1998 11:50:46 -0500

> What temperature and time can the PZT withstand?
>
>
> -----Original Message-----
> From: Phil Rayner 
> To: [email protected] 
> Date: Saturday, October 17, 1998 3:46 PM
> Subject: Bonding bulk PZT to Silicon/Other
>
>
> >Hello everybody,
> >
> >I'm building a piezo micro motor, and I'm looking for methods of bonding
> bulk
> >PZT to a stainless steel or silicon substrate.
> >These can then be lapped/ precision ground down to required thickness (30um
> >or so), giving much better propeties than thin or thick film PZTs, which we
> also
> >do here.
> >Does anybody have any experience of bonding wafers with gold-silicon (or
> >another type of) diffusion bonding, sputtering solder layers down or using
> a sol-
> >gel intermediate layer.
> >Really, I'm looking for a way to avoid epoxy bonding (which could end up
> giving
> >a bond as thick as the PZT), so all ideas will be very much appreciated.
> >
> >Thanking you in advance
> >
> >Phil Rayner
> >
>
>
>