I have never tried to sputter or evaporate Au on diamond or DLC, but
my guess is that Cr is your best bet, for 80 nm of gold. If Cr doesn't
work, another alternative which I know to work (and have used it) is
titanium-tungsten, W-10Ti. The former would allow for more regular
(uninterrupted, non-granular) layers, the latter probably better
adhesion.

An option I have not tried, but it is known to work, is pure titanium.

Finally, tantalum is reported as adhesion layer.

In any case, once you try depositing Au on diamond, please report
back, OK amigo?


m


On 1/5/11, Andrea Mazzolari  wrote:
> Hi all,
>
> i would need to evaporate 80nm of Au on a thin diamond layer.
> Cr is tipically used as adhesion layer while evaporating Au on Silicon.
>
> Is a Cr adhesion layer needed also to evaporate Au on diamond ?
> In the case Cr will not adhere on diamond, which other adhesion layer
> should be used ?
>
> Best regards,
> Andrea