You need high bias power.  BCl3 helps if you've got it.  Dry etching is
mostly physical with a minor chemical component.  Etch rates will be a few
hundred angstroms/min, best case.  You don't mention if you require
selectivity to a mask or if you have a mask present.  For stopping on the
alumina, some CF4 or other source of fluorine will help.

Robert
On Mar 24, 2011 3:49 PM, "Tony Price"  wrote:
> Hello,
>
> Can anyone recommend an RIE recipe for etching RF sputtered barium
strontium
> titanate? It is ~ 500nm thick and it's on alumina substrates.
>
> Thanks,
>
> Tony Price