Adhesion issues are, more often than not, related to surface
preparation.  What have you done to make sure your sample is clean and
dry before deposition?

If your surface prep is inadequate, you are likely to have the same
issues with Ti.

Dan Ruiz
MEMS process engineer
Honeywell
15001 NE 36th Street
Redmond, WA  98073-9701
Phone - 425-376-2167
[email protected]

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf
Of Jie Zou
Sent: Monday, May 16, 2011 7:44 AM
To: General MEMS discussion
Subject: [mems-talk] Adhesion btw silicon nitride and gold?

Hi folks,

I used 10 nm Cr as the adhesion layer between silicon nitride and gold
during e-beam evaporation to make gold bonding pads, well, without
successes... I couldn't bond to it. The metal layer was peeled by my
gold
bonding ball. However on the same sample, bonding works with those gold
layer on the silicon substrate. So it seems my Cr doesn't stick Au to
nitride, but it sticks it pretty well to Si.

Any suggestion? To replace Cr by, say Ti? Or thicker Cr?