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MEMSnet Home: MEMS-Talk: dicing problem with silicon wafer
dicing problem with silicon wafer
2011-05-31
이요석
2011-05-31
Gary Hillman
2011-05-31
Bill Moffat
2011-05-31
Ruiz, Marcos Daniel (SENCOE)
2011-06-01
이요석
2011-06-02
Jie Zou
2011-06-02
Bill Moffat
2011-06-02
Ruiz, Marcos Daniel (SENCOE)
2011-06-10
Jun Hao
2011-06-10
Ned Flanders
2011-06-10
Bill Moffat
dicing problem with silicon wafer
Gary Hillman
2011-05-31
You will need a more energetic method than simply rinsing with water.
Something like a high pressure cleaning system an example can be found on
our web site.

Gary Hillman
S-Cubed
PO Box 365
9 Mars Ct.
Montville, NJ 07039
phone 973-263-0640 ex 35
fax 973-263-8888
Check out our web site and Twitter at www.s-cubed.com


-----Original Message-----
From: [email protected]
[mailto:[email protected]]On Behalf Of
AI?a?R
Sent: Monday, May 30, 2011 10:02 PM
To: [email protected]
Subject: [mems-talk] dicing problem with silicon wafer


I have a dicing problem question. I do not know where the Pt dust particles
came
from. I believe that they came after we diced the Pt/Ti/SiO2/Si wafer. How
should
we clean the wafer? I was thinking about using excessive use of DI water. Do
you
have a better idea?


Thank you,

Joseph Y. Lee
Senior Engineer
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Corporate Technology Operations Headquarters
Micro Fab Group
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