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MEMSnet Home: MEMS-Talk: dicing problem with silicon wafer
dicing problem with silicon wafer
2011-05-31
이요석
2011-05-31
Gary Hillman
2011-05-31
Bill Moffat
2011-05-31
Ruiz, Marcos Daniel (SENCOE)
2011-06-01
이요석
2011-06-02
Jie Zou
2011-06-02
Bill Moffat
2011-06-02
Ruiz, Marcos Daniel (SENCOE)
2011-06-10
Jun Hao
2011-06-10
Ned Flanders
2011-06-10
Bill Moffat
dicing problem with silicon wafer
Bill Moffat
2011-06-02
I think the only way that HF can make silicon hydrophobic is to remove all the
silicon dioxide and leave virgin silicon.  A situation that lasts as long as it
takes the silicon to regrow oxide in astmosphere.  Not long.  A monolayer
chemical modification can turn the surface into a true hydrophobic surface.  The
correct chemicals can produce a surface that is slicker than Teflon. This
surface can survive aggresive treatments. Bill Moffat

________________________________________
From: [email protected] [mems-talk-
[email protected]] on behalf of Jie Zou
[[email protected]]
Sent: Thursday, June 02, 2011 8:53 AM
To: General MEMS discussion
Subject: Re: [mems-talk] dicing problem with silicon wafer

Doesn't HF do that for Si wafers? I don't know for the Pt surfaces.

Jie

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