A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: dicing problem with silicon wafer
dicing problem with silicon wafer
2011-05-31
이요석
2011-05-31
Gary Hillman
2011-05-31
Bill Moffat
2011-05-31
Ruiz, Marcos Daniel (SENCOE)
2011-06-01
이요석
2011-06-02
Jie Zou
2011-06-02
Bill Moffat
2011-06-02
Ruiz, Marcos Daniel (SENCOE)
2011-06-10
Jun Hao
2011-06-10
Ned Flanders
2011-06-10
Bill Moffat
dicing problem with silicon wafer
Ruiz, Marcos Daniel (SENCOE)
2011-06-02
HF works with Si wafers because it removes the hydrophilic oxide.  I would also
like to know how to do that with the Pt surfaces.

Dan

-----Original Message-----
From: mems-talk-bounces+dan.ruiz=honeywell.com@memsnet.org [mailto:mems-talk-
bounces+dan.ruiz=honeywell.com@memsnet.org] On Behalf Of Jie Zou
Sent: Thursday, June 02, 2011 8:54 AM
To: General MEMS discussion
Subject: Re: [mems-talk] dicing problem with silicon wafer

Doesn't HF do that for Si wafers? I don't know for the Pt surfaces.

Jie

reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
MEMStaff Inc.
University Wafer
Tanner EDA by Mentor Graphics
Addison Engineering