what thickness are you targeting?

On Fri, Jun 10, 2011 at 5:03 PM, 첸로 wrote:

>  
>
> Hello
>
> I am using the su-8 spin coating on the silicon wafer. I expect a very flat
> su-8 surface because it determines the photolithography resolution. I always
> failedandthe surface is clearly not flat (there is no bubble) even the su-8
> reflow in the softbake process the bead edge can move to the inner.
>
> Does anybody know how to make a flat surfacein the spin coatingprocesssuch
> as the acceleration time and the last sudden accelerate 1000 rpm or
> something?
>
> Any comments will be highly appreciated.
>
> Kind Regards