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MEMSnet Home: MEMS-Talk: dicing problem with silicon wafer
dicing problem with silicon wafer
2011-05-31
이요석
2011-05-31
Gary Hillman
2011-05-31
Bill Moffat
2011-05-31
Ruiz, Marcos Daniel (SENCOE)
2011-06-01
이요석
2011-06-02
Jie Zou
2011-06-02
Bill Moffat
2011-06-02
Ruiz, Marcos Daniel (SENCOE)
2011-06-10
Jun Hao
2011-06-10
Ned Flanders
2011-06-10
Bill Moffat
dicing problem with silicon wafer
Ned Flanders
2011-06-10
I've once patterned the primed surface (some areas had the HMDS
monolayer, others didn't), and even with long periods of sonication in
acetone, the HMDS monolayer would happily stay on. I was very
impressed


m

On Fri, Jun 10, 2011 at 1:35 PM, Jun Hao  wrote:
> If I am right. Before PR application, the wafers should be primed to promote
> the adhesion of the PR.
>
> HDMS is normally used, and the purpose of it is to make the wafer
> hydrophobic, which can last for a very long time (up to days). Although it
> may not be sufficient enough
>
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