Our DRIE system uses mechanical clamping, and we're now having all
sorts of problems due to this. Even when it works, mechanical clamping
(depending on how it's implemented) introduces the inevitable issue of
the edge of the wafer not being etched. When the mechanical clamp does
NOT work properly, however, you have the additional lovely issue of
the wafer being clamped down wrongly or even broken.

Even though I have no personal experience with electrostatic chucks, I
cannot imagine them being more problematic than mechanical ones.

m

On Thu, Jun 9, 2011 at 10:24 PM, Tepper-Faran Tamar
 wrote:
> DRIE chuck - what is better: mechanical or electrostatic?
>
> Please advise pro's and con's of each type of chuck from your own experience.
>
> Thanks!