One technique that may work is plasma surface activation.  When bonding Teflon
to Teflon if you plasma activate it makes it possible.  When Teflon is in its
original state it is very slick and hydrophobic.  This can be tested with a unit
to measure water contact angle called a Goniometer.  It measures 120 degrees, in
other words water will roll of easily.  With about 1 minute of Argon plasma the
contact angle changes to about 2 to 3 degrees.  This means the surface area has
been increased and bonding is possible.  Checking for time to return to normal.
After 1 week the contact angle was 15 degrees still O.K. for bonding.  After 2
weeks about 30 degrees, after 3 weeks about 60 degrees, after 4 weeks back to
120 degrees.  The Argon plasma is inert and will not oxidize ant surfaces, this
may be the secret.  Bill Moffat

-----Original Message-----
From: [email protected] [mailto:mems-
[email protected]] On Behalf Of Yunda Wang
Sent: Tuesday, July 26, 2011 11:06 PM
To: Shane GUO; General MEMS discussion
Subject: Re: [mems-talk] Bonding Kapton with PDMS

Hi,

One thing I learned is that Kapton bond to almost nothing.

One of our group member used to do Si/PDMS bonding and she suffered a problem
that the PDMS also bond to a copper fixture she used to apply pressure on it. I
suggested her to tape kapton on the fixture to isolate the PDMS from the fixture
because kapton is something don't adhere and can sustain the temperature. It
works.

Best