Stefan,

Coat the wafers with resist before dicing. When removing the resist do not
expose to water.


-----Original Message-----
From: mems-talk-bounces+shay=mizur.com@memsnet.org
[mailto:mems-talk-bounces+shay=mizur.com@memsnet.org] On Behalf Of Stefan
Braun
Sent: Tuesday, August 23, 2011 11:29 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] black Aluminum pads

Dear colleagues,

I open oxide on silicon to form contact holes, sputter 100% Aluminum, then
pattern the Aluminum, followed by a form gas anneal (FGA). Then, at the end
of the process, the wafers are diced and after dicing my Aluminum pads turn
'black'. Not all of them and the 'black' is all from slightly darker to
completely black. Has anyone of ever seen something like that before?

Thanks and best regards,

Stefan