Hi Alex,

Thanks a lot for your reply. I have not yet come up with a plan to do
optical lithography about the device, and I will have to use ebeam
lithography and bi-layer PMMA for another while. Do you happen to have any
successful ALD lift-off experience with PMMA?

I have thought of adding another lithography layer to etch the ALD coating
and expose the bottom contact to probe. I worried about any HF-based wet
etching will take away the adhesion layer of my bottom contact. Also I doubt
whether I can find a dry etching tool that allows gold inside (I do most of
my processing CNF at Ithaca, NY).

Best regards,

Josh

On Thu, Sep 15, 2011 at 2:19 PM, Alex Mellnik  wrote:

> If you also do a lift-off process (which is particularly easy if you use a
> LOR/S18xx bilayer) then you can just let the bottom electrode extend out
> from underneath the ALD layer in one direction.  If you don't you can just
> etch through the ALD layer on one side of the top electrode...
>
> -Alex

--
Photonics Lab
Rochester Inst of Tech
Rochester, NY 14623