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MEMSnet Home: MEMS-Talk: Re: Source for SOI wafers, wafer bonding source, etc
Re: Source for SOI wafers, wafer bonding source, etc
1998-12-11
[email protected]
Re: Source for SOI wafers, wafer bonding source, etc
[email protected]
1998-12-11
Adam Cohen wrote:

> Dear Colleagues,
>
> We are seeking a source for a small quantity of SOI wafers with a Si
> thickness of about 50 microns for deep silicon RIE. We would prefer 4"
> diameter wafers, but other sizes may be acceptable. Substrate/overall
> thickness should be as large as possible.

Hi Adam,

Further to your 50um SOI request, I would like to introduce BCO Technologies.

BCO Technologies is a value added supplier of SOI wafers for custom solutions.


In addition to wafer bonding our technologies include photo, diffusion, deep
silicon  etch (RIE and ICP, grinding and polishing. Wafer bonding included
pre-processed or pre-cavitated wafers.

We supply quantities upwards of 10 wafers to Research Institutes and
Universities.

Do not hesistate to contact us.


Regards



Conor.




***********************************************
Conor Quinn (Senior Applications Engineer)
BCO Technologies
339, Glen Road
Belfast
BT11 8BU.
Northern Ireland.

T +44 1232 615599 x247
F : +44 1232 602088
http://www.BCO-Technologies.com
***********************************************


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