If you can make a lot of holes, all slightly off center from each other in an
array, when you cleave the wafer you are bound to go through one or more of your
holes.  Otherwise, perhaps FIB would work.

 > Date: Wed, 14 Dec 2011 20:15:44 -0700
> From: yundawang@gmail.com
> To: mems-talk@memsnet.org
> Subject: Re: [mems-talk] Cross section view of SEM image
>
> Hi,
>
> If possible, you can pattern a "pre-defined cutting line" which is
> aligned to the center of you hole at the same time when you are doing
> your DRIE (see attached pic). After that, you can break the wafer
> alone the pre-cutted line and the crack will go along with the crystal
> direction giving you a really smooth side wall.
>
> 2011/11/7 ning xue :
> > Hi,
> >
> > I am planing to have a look at the cross section of my deep silicon etching
> > sample by SEM. I found that it is really difficult to manually cut the
> > slicon sample right along the diameter of the etcher hole. Is there any
> > good way to cut the wafer nicely and the cut side goes through the center
> > of etched hole?
> >
> > Thanks
> > Ning