Hi Domenico,

Can you please give some references about your work with Thiol for bonding?

I experimented with around 12lbs weight at 100 degrees C for an hour. It
didn't work. I am just using Si wafers with Au-Au layers, which are plasma
activated (1 minute of plasma etching just before bonding). Then I bond
them at room temperature and then anneal them in an oven for sometime. I
will surely try the same at 200 degrees C.

On Wed, Jan 18, 2012 at 1:17 AM, dtulli  wrote:

> During my work, I've been using a thiol (dodecanthiol, hexanthiol...) to
> bond two films (around 100nm) of Au deposited on glass. After forming a SAM
> (self assembled monolayer), I put a weight on top of my samples and left
> them in a oven for several hours at a temperature around 200ºC.
> I tested the strength of the bonding by lapping and dicing the samples and
> it worked.
>
> Hope this help.
> Best.
>
> Domenico.