Hi all,

At this moment we evaporate a 10nm Cr/200nm Pt film onto
a PECVD applied SiO2 layer.

But afterwards we observe sever adhesion problems, despite
an O2 plasma prior to evaporation.

Does someone has another suggestion to improve adhesion of the Cr/Pt film
towards the SiO2 layer?

We cannot use a sputter process.

Many thanks in advance.

Peter Kuijpers
Process Integrator
Philips Innovation Services
MiPlaza/TL group
High Tech Campus 04-p4.20
5656 AE Eindhoven
The Netherlands
Phone: +31 402798904
Mobile:+31 612507027,
Email: [email protected]