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MEMSnet Home: MEMS-Talk: Low temperature Al-Al bonding
Low temperature Al-Al bonding
2012-02-03
Pietro Maoddi
2012-02-06
Matthieu Nannini, Dr.
2012-02-06
Pietro Maoddi
2012-02-07
Pietro Maoddi
2012-02-07
Tony Rogers
Low temperature Al-Al bonding
Pietro Maoddi
2012-02-06
Dear Matthieu,

Thank you for your answer. Unfortunately those aluminum layers are not
optional: I actually need them for my application.

Alignment is not a problem as we have the equipment to do it (bonder
alignment tool for Suss MA6).
Any other idea?

Best,
Pietro

-----Messaggio originale-----
From: Matthieu Nannini, Dr.
Sent: Monday, February 06, 2012 4:16 PM
To: 
Cc: [email protected]
Subject: Re: Low temperature Al-Al bonding

Dear Pietro,

If I were you, I would try to bond the 2 SU8 wafers in a regular oven with a
simple weight of them and forget about Al-Al coating and bonding. If you
need alignment, check with your fab staff if you can put the alignment jig
in an oven @ 150°C or so.

Matthieu

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