Hi,
We've also seen issues with this when dicing sapphire wafers. I usually
strip the resist with the chip upside-down, which works most of the time. An
alternative used in our lab is a two layer resist, first PMMA 950K, then
standard positive photoresist. After dicing, the photo resist is stripped
with developer, ideally stirring the chips upside down, which removes most
particles. The pmma layer is then removed using acetone, which also removes
the remaining particles. Beware of pmma residue though.
Hope this helps,
Gabriel
Quantum Device Lab, ETHZ
-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of
ProtoSi Info
Sent: Tuesday, July 24, 2012 9:22 PM
To: [email protected]
Subject: [mems-talk] dicing particle contamination
Hello
We've been struggling with particles getting embedded in our delicate
silicon comb structures during dicing. Our current process involves spraying
on a 10um thick layer of photoresist over the entire wafer and then do a
soft bake. After dicing we rinse the wafer to remove particles before
stripping off the resist. However we're still getting particles stuck
in-between the comb fingers. We've attempted ultrasonic cleaning but that
damages the combs.
Any tips to remove or prevent particles would be greatly appreciated.
Thank you
Kevin Chang
ProtoSi
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