Hi Kevin,
You can reduce the particle problem even more if you put the wafer between two
layers of sticky foil after the softbake
regards

Carel Heerkens
-----Original Message-----
From: [email protected] [mailto:mems-talk-
[email protected]] On Behalf Of ProtoSi Info
Sent: dinsdag 24 juli 2012 21:22
To: [email protected]
Subject: [mems-talk] dicing particle contamination

Hello

We've been struggling with particles getting embedded in our delicate silicon
comb structures during dicing. Our current process involves spraying on a 10um
thick layer of photoresist over the entire wafer and then do a soft bake. After
dicing we rinse the wafer to remove particles before stripping off the resist.
However we're still getting particles stuck in-between the comb fingers. We've
attempted ultrasonic cleaning but that damages the combs.

Any tips to remove or prevent particles would be greatly appreciated.

Thank you
Kevin Chang
ProtoSi
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Visit us at http://www.mems-exchange.org

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