Producing hydrophobic layers using commercial CVD units allows the particles to
be spray cleaned away, much easier.
-----Original Message-----
From: [email protected] [mailto:mems-
[email protected]] On Behalf Of Yingtao Tian
Sent: Wednesday, July 25, 2012 2:24 AM
To: General MEMS discussion
Subject: Re: [mems-talk] dicing particle contamination
Hi Kevin,
Maybe worth to look at the laser dicing technique. Discoeruope is an interesting
one.
Regards,
Yingtao
-----Original Message-----
From: [email protected] [mailto:mems-talk-
[email protected]] On Behalf Of ProtoSi Info
Sent: 24 July 2012 20:22
To: [email protected]
Subject: [mems-talk] dicing particle contamination
Hello
We've been struggling with particles getting embedded in our delicate silicon
comb structures during dicing. Our current process involves spraying on a 10um
thick layer of photoresist over the entire wafer and then do a soft bake. After
dicing we rinse the wafer to remove particles before stripping off the resist.
However we're still getting particles stuck in-between the comb fingers. We've
attempted ultrasonic cleaning but that damages the combs.
Any tips to remove or prevent particles would be greatly appreciated.
Thank you
Kevin Chang
ProtoSi
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_______________________________________________
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_______________________________________________
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provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org
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To unsubscribe:
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