Hi Shree,
   First, a lot of fab's do not like for metal (as is on your handle wafer)
to be exposed to the plasma of the DRIE.  The metal will sputter, redeposit
on your etched structures (and the ceramic inside the DRIE) and cause
micromasking.  This can lead to grass formation in your etched area.
  We have used silver loaded thermal grease in the past but have also had a
problem removing it after etching; particularly after etching completely
through a wafer.  We routinely use a thick resist (SPR 220, 5-7um) on the
back of the etch wafer and a layer of thinner resist (1827) on the handle
wafer.  Then to release after the etch just soak both of them in acetone.
Of course having a thick resist on the back will lower the thermal
conductivity and may have some deleterious effects on side wall angle if
you are etching deep, high aspect ratio features.

Cheers,
   Michael



On Wed, Dec 5, 2012 at 3:24 PM, Tinka Li  wrote:

> Hi Shree,
>
> You meant something like Fomblin oil? 1 or 2 drops on your carrier,
> smear out nicely, would do the chucking perfectly. Can also easily
> remove (slide) your wafer out of your carrier wafer after DRIE. BUT, you
> may have a little trouble in cleaning our wafer afterwards.
>
> Prime Wafers
> Rotterdam, NL
>
> -----Original Message-----
> From: mems-talk-bounces+t.li=primewafers.com@memsnet.org
> [mailto:mems-talk-bounces+t.li=primewafers.com@memsnet.org] On Behalf Of
> Shree Narayanan
> Sent: Wednesday, December 05, 2012 4:36 PM
> To: General MEMS discussion
> Subject: [mems-talk] Adhesive to bond onto a carrier wafer for etching
>
> Hello all,
>
> I need to mount a 4" silicon wafer on a 6" metallized carrier wafer, in
> order to etch it in a Alcatel deep-reactive ion etcher. I am wondering
> if
> someone has used thermal vacuum grease for this purpose that can be
> removed
> easily at the end. The silicon wafer is patterned with photoresist and
> has
> no other material on it.
>
> Thanks
> Shree
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