I've used SU 8-2100, many times. After cure, the film shrinks by about
5-10%. If the substrate is perfectly smooth, like silicon, then the
SU8 will slightly curl up and lift off the substrate. The key to
improving adhesion is to provide a key :-)  If the surface can be
roughened some how, then it works better. This is common practice when
using epoxy adhesives to bond metal parts. One always cleans and
abrades the surfaces.



On Tue, Jul 2, 2013 at 12:03 PM, Sophie Roman  wrote:
> Hello,
>
> I am currently using SU-8 2025 to make 500µm thick devices (without
> multiple layers) and I don't have adhesion problems. How long is your
> pre-exposure bake ? You can try to increase the exposure dose and/or the
> pre-exposure bake duration to avoid adhesion problems. In addition, it is
> important to let the resin relax at room temperature between each step of
> the protocol to avoid too many constraints.
>
> Best regards,
>
> Sophie Roman
>
> Post-doc
> Laboratoire Charles Coulomb,
> place Eugène Bataillon,
> Montpellier 34090
> France
>
>
> 2013/7/2 Tong CHEN 
>
>> Hello,
>>
>> dose anybody use SU-8 2050 to make 100um of thickness, I have totally
>> adhesion failure when I deposit it on a Omnicoat(from Microchem too)surface
>> on Si, when I do the development, the patterns can be removed by twizzer, I
>> made up to 550mj/cm2 of exposure, and PEB 95C 12 min, it still didn't work.
>> I don't know where the problem is.
>>
>> Thanks for your help
>>
>> --
>> Tong Chen
>> Postdoc
>> SyntheCell Team
>> IGDR CNRS UMR 6290
>> 2, Avenue du Professeur Léon Bernard
>> 35043 Rennes
>> France
>>
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