Hi All,

I have been testing this chemically amplified negative tone photoresist on
copper for some time now. I have found that:


1.       There is adhesion issue between Copper and the resist. Does anyone know
the reason behind it.

2.       The dedicated developer RD6 shows leaves marks on the copper. As though
because of contamination. Does anyone know how to over come this. I am working
in a completely metal-ion free bench.

Many Thanks,
Ricky
Tyndall National Institute
Cork, Ireland
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