Hello,



I think it’s a problem of lacking adhesion to the substrate. It’s typical for
SU-8 that it contracts during the baking step if the adhesion isn’t optimal. I
would suggest to use an adhesion promoter like TI-Prime (from MicroChemicals).



Regards,



André



Von: [email protected] [mailto:mems-
[email protected]] Im Auftrag von
KarthiKeyan K
Gesendet: Samstag, 17. Oktober 2015 05:49
An: General MEMS discussion
Betreff: [mems-talk] How to avoid pin holes on SU8 2075



Dear Friends,

Please suggest how to avoid pin holes on SU8 2075 photoresist layer during Pre &
Post baking process at 65C & 95C temperature (temperature has followed as per
the data sheet instructions).

There is no pi holes and air bubbles during spin process but i can see 1 or 2
pin holes under the size is 300-500 microns so please give me the suggestion for
the same.

--



Thanks & Best Regards,

KarthiKeyan K

Mobile No: +91-9944477213

Email ID: [email protected] 



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