Hi,
   I am new to the list and new to MEMS.  My background is in semiconductor
processing (thin films, oxidation, metallization, planarization) and a
little micromachining (photosensitive glass processing).  I am trying to
design a process to form a structure with long metal lines using a flat
substrate with a conductive base, thick photoresist and copper or nickel
plating.  I have looked at most of the information about SU-8 and LIGA
techniques. My questions are:
-Anyone know the email address of the company (can't think of their name
right now) selling SU-8, the *mcc.com address was returned to me?

-I have read that the length to width of the resist should be restricted to
less than 10 to 1 with LIGA techniques.  I have also seen SEM photos of
coils (inductors) with a length far exceeding the width.  Does the
curvature of the lines aid in the mechanical integrity of the resist line?

-can a sinulsoidal modulation of a long resist line aid in mechanical
stability? If so, what is the maximum length to width?

-are there a set of process conditions that can be followed to ensure the
stability of long resist lines (such as storing at low relative humidity
right up to plating or some specific curing cycle)?

-if no to the above, how about a technique that bridges the resist lines
with relatively short orthogonal lines before the develop cycle?  PVD or
evaporated metal or low temperature CVD through a mask?  After develop,
these lines support the resist and maintain a constant spacing.  These will
then be removed when the resist is stripped.

thanks in advance,
Jaime