Dear MEMS community,
  I would like to ask if anyone has experience of Au-Au bonding on silicon
substrates.
We want to know the bonding temperature, pressure and the thickness of the
Au layer.



Thanks very much.
Regards
Junhua Zhu
_____________________________________________________

Junhua Zhu
MEME Research Group
Department of Precision Instruments
Tsinghua Univ.
Beijing
P.R. China
100084