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MEMSnet Home: MEMS-Talk: package problem
package problem
1999-08-26
jae hong LIM
package problem
jae hong LIM
1999-08-26
hi everyone.
now i made a pressure sensor.then i did anodic bond between silicon and
glass.
but i have a problem to measure the resistive change.
because i can't attach it to a package
(it has to be very tight sealing for the air not to flow.
and also not to affect the resistive change)
if anyone knows the material for thislet me know pleasethanks for
reading....
always i hope you'd be happy...cell phone : 011-478-8047
mail : [email protected]       [email protected]
       [email protected]


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